Other things… You seem to have .05mm spacers for that gap I think I may need to be bigger gap but that’s not the point for this: you could try making those static form spacers into more flexing bumber shape - and/or maybe use such on the sides too. The idea being that when kinetic energy is transferred to the case (you drop it and it hits the floor) and it transfers that energy to the phone (but dampens it via the case), the static shapes transfer as well as their form and material allows. But if those same shapes would be something that itself bends, then the transfer of that kinetic energy could be much less. For this flexing movement a bit more room may be needed, depending on the shape but thick back and sides would allow to create such recesses.
One such shape would be something similar to a diving board: a longer piece that’s only attached from one end, is a bit of an angle (or is arch like) towards the phone and can bend a bit down. If those are on all sides, it would keep the phone snugly in place while allowing for airflow and possibly keeping the phone a bit more safe. If it’s designed right, those should be printable.
A bit more “version 2” maybe.
Like (not to scale and measurements are just suggestions - designs need testing):
I think that would be printable yeah. But possibly better with slightly more flexible PETG (I’m using PLA, that might still work though). I’ll keep that in mind if I start doing further variations, that’s a cool idea.
Edit: Oh, most of the spacers are .5mm, not .05mm. But yeah I guess it’d still need a little more room for “inertial dampeners”.
After the inertial dampeners are invented, we just need the warp drive and shields, maybe a photon torpedo bay at the top for firing at Apple users?
It is more productive to continue developing the Purism community instead since our collective pool of replenishable resources does not compare favourably against the duopoly.
Looks like they are already working on active cooling at a ‘micro’ scale: xMEMS | Active Micro Cooling | XMC-2400 (at 1mm thick I would probably call it ‘nano’, holy crap). But since it’s meant to actually be on a chip (I think) it’ll probably never even be accessible for “hobby” consumers.
But this is tempting… it even blows air horizontally instead so you don’t need to leave additional space for airflow… I think.
Revision 4
Made a few minor adjustments to increase air gaps even more. Now a full 1mm gap behind the back and “in theory” (but probably not in reality) airflow possible from the bottom opening towards the top openings.
I think for an active cooling version, I’d need to seal up most of the gaps near the button openings and such (doable I think), and seal up the camera opening with a wall around it so it’s flush with the phone. Otherwise air would be going out from everywhere other than the hot zone/vent where it’d help the most (plus it might be annoying otherwise).
Then the back would need to be significantly thicker. Right now it’s 2mm (case) + 1mm (gap). Even with one of those fans that shoots air out sideways, they seem to be 4mm thick typically. So 4mm + whatever is needed to hold and protect such a micro fan, and the back (plastic) would need to be made decently thin for airflow.
It would go from “thicc case” to “CaseZilla”, but it does seem 100% feasible. The issue for me would be powering it somehow. My dc electric skills are mediocre at best and rusty on top of that.
