Could you please state some details regarding the state of hardware and pcb for Aspen and Birch. I am especially interested in the pcb state, what are the optimisations? Are there any improvements regarding heat/energy consumption? Or are the changes of the pcb targeting manufacturing and cost optimisation?
Also where can I find the schematics? I have been scanning through the repos but did not find it, perhaps that would answer my questions.
I would greatly appreciate some details in order to understand the hardware of Aspen and Birch. Thank you again and congratulations - very excited about the Librem Phone!