the CPU will be flipped to the opposite side of the mainboard of the Librem 5. This means routing it to the other side, printing new circuit boards, changing the surface mount technology (SMT) process, as well as minor mechanical design change. This is to utilize the surface area of the inner aluminum chassis as increased thermal dissipation rather than complicating thermal dissipation through the back case. This of course is one of the many steps of optimization, the primary one is kernel development to optimize CPU/GPU/RAM, where we will see the greatest areas of improvement (that we’ve reproduced).
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