… which raises a good question: Is the proposed IR sensor even viable? i.e. is it blob-free?
Technically speaking, the Librem 5 already has IR hardware - but it is well beyond my knowledge as to what the overlap and gaps would be between the existing IR hardware and the proposed sensor.
GNU: Purism: Please make the Librem 5 Fir a Delicious Desing, and 5.0 Inch only.
Please add an infrared sensor in the front of Librem 5 next to 3.5mm jack
I think the IR sensor is more of a novelty thing. For the times you would use it couldn’t you use a USB sensor and just plug it into the L5? Like I said before, the biggest issue is refining what we already have. Power management is top priority I think because it’s a bit too reliant on being close to a power source to feel like you can spend the whole day on a charge. And other refinements like the gps/camera/bluetooth, that all needs to work better, mind you a lot of that is software development and not hardware.
The other thing is the user upgrade/service angle which I think isn’t what I thought it would be. It seems like that was touted as a feature but a dangerous one that potentially voids your warranty and that wasn’t emphasized enough in my mind. For modules with antennas a different solution other than the u.fl connector on the board needs to be developed. Even if they had a u.fl adaptor of some sort that was higher cycle count for connection/disconnection as new cards become available. People will want to upgrade these themselves but not if they are going to destroy a connector on a costly card or the mainboard itself.
Please please please remove in GeNUine FIR batch the RIDICULOUS mono speaker, add 2 LR next-gen stereous speaker. Purism you got it and put all the Manpower in Fir phone.
It should be able to support swapping with other modems and wifi/bluetooth cards more easily. Maybe come with a fast world modem out of the box. Also maybe improved modular design for repairability (maybe not as extreme as Fairphone but moving in that direction).
Fir: Please Please, Please Remove the Ridiculous sides Metals and only leave the Top and Bottom Metals. why? this will dramatically reduces the feeling of Heat when Holding it. Also add Fancy Metal to drain heat on up down…
Silver has the highest thermal conductivity. Copper is pretty close to silver, and is more commonly used in heatsinks. However, silver is very soft, and copper tarnishes easily when exposed to air, so they require frequent maintenance.
Gold is also very soft and it is the most malleable metal, so it needs to be an alloy, otherwise gold plating will chip away very quickly with minimal effort.